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LMP7718MAE/NOPB - Texas Instruments

Description: Operational Amplifiers - Op Amps 88 MHz, Precision, Low Noise, 1.8V CMOS Input, Decompensated Operational Amplifier 8-SOIC -40 to 125

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LMP7718MAE/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G8)
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LMP7718MAE/NOPB - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G8)
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LMP7718MAE/NOPB Details

  • Manufacturer Part Number:

    LMP7718MAE/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    85 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES (AVCL>=10)

  • Input Offset Current-Max (IIO):

    5e-7 µA

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    28 V/us

  • Supply Current-Max:

    3.4 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    88000

  • Voltage Gain-Min:

    10000

  • Wideband:

    YES

  • Width:

    3.91 mm

LMP7718MAE/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using bypass capacitors to reduce noise and oscillations.
  • To ensure stability, follow the recommended compensation network in the datasheet, and make sure to decouple the input and output pins with suitable capacitors. Additionally, ensure that the PCB layout is well-designed, and the device is properly bypassed and grounded.
  • The LMP7718MAE/NOPB can drive capacitive loads up to 1000 pF, but it's recommended to limit the load capacitance to 100 pF or less to ensure stability and optimal performance.
  • The LMP7718MAE/NOPB is rated for operation up to 125°C, but it's recommended to derate the device's performance and consider thermal management techniques, such as heat sinking or thermal interface materials, to ensure reliable operation in high-temperature environments.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins to protect the device from electrostatic discharge events. Additionally, consider using overvoltage protection devices, such as voltage regulators or overvoltage protection ICs, to protect the device from voltage transients and overvoltage conditions.

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LMP7718MAE/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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