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LMP8270MA/NOPB - Texas Instruments

Description: Differential Amplifiers

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PCB Footprints
LMP8270MA/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin SOIC 2021
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3D Models
LMP8270MA/NOPB - Texas Instruments  - 3D model - Small Outline Packages - 8-Pin SOIC 2021
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LMP8270MA/NOPB Details

  • Manufacturer Part Number:

    LMP8270MA/NOPB

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOP, SOP8,.25

  • Pin Count:

    8

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Average Bias Current-Max (IIB):

    0.02 µA

  • Common-mode Reject Ratio-Nom:

    78 dB

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.902 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.753 mm

  • Slew Rate-Nom:

    0.7 V/us

  • Supply Current-Max:

    1.4 mA

  • Supply Voltage Limit-Max:

    5.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    80

  • Width:

    3.899 mm

LMP8270MA/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMP8270MA/NOPB involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the input and output capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the input and output capacitors are of high quality and have low ESR. It's also important to decouple the power supply pins with a 10uF capacitor and a 100nF capacitor in parallel.
  • The maximum power dissipation of the LMP8270MA/NOPB is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at an ambient temperature of 25°C. However, this value can be derated at higher temperatures.
  • The LMP8270MA/NOPB is rated for operation up to 125°C, but the maximum power dissipation decreases at higher temperatures. It's recommended to derate the power dissipation according to the datasheet and to ensure that the device is properly heat-sinked to prevent overheating.
  • To troubleshoot oscillations or instability, check the PCB layout and ensure that it follows the recommended guidelines. Verify that the input and output capacitors are of high quality and have low ESR. Also, check the power supply rails for noise and ensure that the device is properly decoupled. If the issue persists, try adding a small capacitor (e.g. 10nF) in parallel with the output capacitor to improve stability.

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LMP8270MA/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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