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LMP8481MM-H/NOPB - Texas Instruments

Description: 76-V, Bi-Directional, High-Side, High-Speed, Voltage Output Current Sensing Amplifier

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LMP8481MM-H/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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LMP8481MM-H/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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LMP8481MM-H/NOPB Details

  • Manufacturer Part Number:

    LMP8481MM-H/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    12 µA

  • Bandwidth (3dB)-Nom:

    0.27 MHz

  • Common Mode Voltage-Max:

    76 V

  • Common-mode Reject Ratio-Min:

    100 dB

  • Common-mode Reject Ratio-Nom:

    124 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    265 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.07 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    0.155 mA

  • Supply Voltage Limit-Max:

    85 V

  • Supply Voltage-Nom (Vsup):

    16 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    270

  • Voltage Gain-Min:

    99.2

  • Voltage Gain-Nom:

    100

  • Wideband:

    NO

  • Width:

    3 mm

LMP8481MM-H/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMP8481MM-H/NOPB involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the input and output capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability and prevent oscillations, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, make sure to use a sufficient output capacitor value, and consider adding a small series resistor (e.g., 1-10 ohms) between the output and the capacitor to dampen oscillations.
  • The LMP8481MM-H/NOPB can handle input voltages up to 42V, but it's recommended to operate within the specified input voltage range (2.7V to 36V) for optimal performance and reliability.
  • The LMP8481MM-H/NOPB is rated for operation up to 125°C, but it's essential to consider the device's power dissipation and thermal management when operating in high-temperature environments. Ensure proper heat sinking and consider derating the device's output current accordingly.
  • When selecting an output capacitor for the LMP8481MM-H/NOPB, consider the capacitor's equivalent series resistance (ESR), capacitance value, and voltage rating. A general guideline is to use a capacitor with an ESR of 0.1 ohms or less, a capacitance value of 10uF or higher, and a voltage rating that exceeds the output voltage.

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LMP8481MM-H/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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