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LMP90080MH/NOPB - Texas Instruments

Description: Analog to Digital Converters - ADC Multi-Channel, Low-Power 16-Bit Sensor AFE with True Continuous Background Calibration 28-HTSSOP -40 to 125

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LMP90080MH/NOPB - Texas Instruments - PCB symbol
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LMP90080MH/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - HTSSOP
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LMP90080MH/NOPB - Texas Instruments - 3D model - Small Outline Packages - HTSSOP
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LMP90080MH/NOPB Details

  • Manufacturer Part Number:

    LMP90080MH/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • Input Voltage-Max:

    5.5 V

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.85 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LMP90080MH/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMP90080MH involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the input traces to reduce noise and interference.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines, and consider adding a capacitor in parallel with the output to improve stability and reduce oscillations.
  • The maximum power dissipation of the LMP90080MH is dependent on the ambient temperature and the thermal resistance of the package. Refer to the thermal characteristics table in the datasheet for more information.
  • The LMP90080MH is rated for operation up to 125°C, but the maximum junction temperature should not exceed 150°C. Ensure proper heat sinking and thermal management to prevent overheating.
  • Start by verifying the power supply voltage, input signals, and output loads. Check for proper PCB layout, decoupling, and grounding. Use an oscilloscope to inspect the input and output waveforms for signs of oscillation or instability.

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LMP90080MH/NOPB Overview

Use the download button to access the LMP90080MH/NOPB schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LMP90, or try a keyword search, such as Other Signal Circuits

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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