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LMP90097MHE/NOPB - Texas Instruments

Description: 24-Bit Sensor AFE with True Continuous Background Calibration

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LMP90097MHE/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PWP0028A
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LMP90097MHE/NOPB - Texas Instruments  - 3D model - Small Outline Packages - PWP0028A
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LMP90097MHE/NOPB Details

  • Manufacturer Part Number:

    LMP90097MHE/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • Input Voltage-Max:

    5.5 V

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    7

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.85 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LMP90097MHE/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines for signal traces.
  • To ensure accurate temperature measurement, it's essential to follow proper PCB design and layout guidelines, minimize thermal gradients, and calibrate the internal temperature sensor using the calibration registers provided in the datasheet.
  • The maximum power dissipation for the LMP90097MHE/NOPB is dependent on the operating conditions, such as supply voltage, current, and ambient temperature. The datasheet provides a power dissipation calculation formula, and it's recommended to follow thermal design guidelines to ensure the device operates within the specified temperature range.
  • To optimize noise performance, it's recommended to follow the datasheet guidelines for pin configuration, decoupling, and filtering. Additionally, using a low-noise power supply, minimizing digital noise, and using shielding or guard rings can help reduce noise and improve overall performance.
  • The recommended clocking scheme for the LMP90097MHE/NOPB is to use a low-jitter clock source, such as a crystal oscillator or a high-quality clock generator. To minimize clock jitter, it's essential to follow proper PCB design guidelines, use a low-noise power supply, and ensure the clock signal is properly terminated and filtered.

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LMP90097MHE/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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