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LMQ61460AFSQRJRRQ1 - Texas Instruments

Description: Conv DC-DC 3V to 36V Synchronous Step Down Single-Out 1V to 34.2V 6A Automotive T/R

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LMQ61460AFSQRJRRQ1 - Texas Instruments PCB footprint - Other - Other - LMQ61460AFSQRJRRQ1-2
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LMQ61460AFSQRJRRQ1 - Texas Instruments  - 3D model - Other - LMQ61460AFSQRJRRQ1-2
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LMQ61460AFSQRJRRQ1 Details

  • Manufacturer Part Number:

    LMQ61460AFSQRJRRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2020-09-26

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    13.5 V

  • JESD-30 Code:

    R-PQCC-N14

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    6 A

  • Output Voltage-Max:

    34 V

  • Output Voltage-Min:

    1 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC14,.14X.16(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2200 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

LMQ61460AFSQRJRRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to improve heat dissipation.
  • To ensure reliable operation across the full temperature range, it is essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is operated within its specified voltage and current ratings.
  • The critical timing parameters for the LMQ61460AFSQRJRRQ1 include the input rise and fall times, output rise and fall times, and the propagation delay. These parameters are critical to ensure proper operation and should be carefully considered during design and layout.
  • ESD protection for the LMQ61460AFSQRJRRQ1 can be achieved through the use of ESD protection diodes, TVS diodes, or other ESD protection devices. It is essential to follow proper PCB design and layout guidelines to ensure that the ESD protection devices are properly connected and functional.
  • The recommended power sequencing and voltage ramp rates for the LMQ61460AFSQRJRRQ1 are specified in the datasheet. It is essential to follow these guidelines to ensure proper operation and to prevent damage to the device.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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