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LMR12010YMKE/NOPB - Texas Instruments

Description: Texas Instruments LMR12010YMKE/NOPB, Buck Converter, 1A, 20 V, Step Down, 3.6 MHz, 6-Pin, SOT

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PCB Footprints
LMR12010YMKE/NOPB - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DDC0006A
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3D Models
LMR12010YMKE/NOPB - Texas Instruments  - 3D model - SOT23 (6-Pin) - DDC0006A
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LMR12010YMKE/NOPB Details

  • Manufacturer Part Number:

    LMR12010YMKE/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    17 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    3000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

LMR12010YMKE/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Additionally, keeping the thermal pad clear of any obstacles and ensuring good airflow around the device can help improve thermal performance.
  • To ensure the device operates within the recommended operating conditions, it's essential to follow the recommended voltage and current ratings, as well as the thermal guidelines outlined in the datasheet. Additionally, proper PCB design, component selection, and thermal management can help prevent overheating and ensure reliable operation.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It's essential to ensure the device operates within the recommended temperature range to prevent thermal stress and ensure reliable operation.
  • To troubleshoot issues with the device, start by reviewing the datasheet and application notes to ensure proper usage and configuration. Check for proper power supply, voltage, and current ratings. Verify that the device is operating within the recommended temperature range. If issues persist, consult with a Texas Instruments support engineer or a qualified electronics engineer for further assistance.
  • When using the device in a high-reliability or safety-critical application, it's essential to follow the recommended design and testing guidelines outlined in the datasheet and application notes. Additionally, consider implementing redundant systems, error detection and correction mechanisms, and fail-safe designs to ensure the highest level of reliability and safety.

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LMR12010YMKE/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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