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LMR14006YDDCR - Texas Instruments

Description: Voltage Regulators - Switching Regulators Wide Vin 40V 600mA Buck Regulator

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PCB Footprints
LMR14006YDDCR - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DDC0006A
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3D Models
LMR14006YDDCR - Texas Instruments  - 3D model - SOT23 (6-Pin) - DDC0006A
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LMR14006YDDCR Details

  • Manufacturer Part Number:

    LMR14006YDDCR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    4 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    11.6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.6 A

  • Output Voltage-Max:

    30 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2100 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

LMR14006YDDCR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Additionally, keeping the thermal vias small and numerous can help to reduce thermal resistance.
  • To ensure the device operates within the recommended operating conditions, monitor the input voltage, output voltage, and output current. Ensure the input voltage is within the recommended range of 4.5V to 42V, and the output voltage is within the recommended range of 0.8V to 40V. Also, ensure the output current does not exceed the recommended maximum current of 6A.
  • When handling the device, take precautions to prevent electrostatic discharge (ESD) damage. Use an ESD wrist strap or mat, and handle the device by the body or pins, rather than the leads. Also, avoid touching the device's pins or leads with bare hands, as the oils from human skin can cause corrosion.
  • To troubleshoot issues with the device, start by checking the input voltage, output voltage, and output current. Verify that the device is operating within the recommended operating conditions. Check for signs of overheating, such as excessive temperature or thermal shutdown. If the issue persists, consult the datasheet and application notes for guidance, or contact Texas Instruments' support team.
  • The device has a maximum junction temperature of 150°C. Ensure good thermal conductivity between the device and the heat sink or thermal pad. Use a thermal interface material (TIM) to fill any gaps between the device and the heat sink. Also, ensure good airflow around the device to prevent overheating.

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LMR14006YDDCR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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