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LMR33630CDDA - Texas Instruments

Description: SIMPLE SWITCHER® 3.8V to 36V, 3A Synchronous Buck Converter With Ultra-Low EMI

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LMR33630CDDA - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DDA0008J SOIC
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LMR33630CDDA - Texas Instruments  - 3D model - Small Outline Packages - DDA0008J SOIC
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LMR33630CDDA Details

  • Manufacturer Part Number:

    LMR33630CDDA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO VOUT=5 VOLT;PFM TECHNIQUE ALSO USED

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    3.8 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    34 V

  • Output Voltage-Min:

    1 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.7 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2100 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

LMR33630CDDA Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Additionally, placing vias under the device can help to dissipate heat more efficiently.
  • To ensure stability and prevent oscillations in the output voltage, it is recommended to use a minimum output capacitance of 10uF, and to place the output capacitor close to the output pin. Additionally, using a low-ESR capacitor and minimizing the loop area of the output traces can help to reduce oscillations.
  • The recommended input capacitor value is 10uF to 22uF, and a low-ESR ceramic capacitor such as X5R or X7R is recommended. The input capacitor should be placed close to the input pin and should have a voltage rating that is at least 1.5 times the maximum input voltage.
  • The output voltage ripple and noise can be calculated using the following formula: ΔVout = (Iout * Rload) / (fsw * Cout), where ΔVout is the output voltage ripple, Iout is the output current, Rload is the load resistance, fsw is the switching frequency, and Cout is the output capacitance. Additionally, the output voltage noise can be estimated using the datasheet specifications for output voltage noise density and the output capacitance.
  • For high-power applications, a thermal management strategy that involves using a heat sink, thermal interface material, and a fan or other cooling system is recommended. The heat sink should be designed to have a low thermal resistance and should be attached to the device using a thermal interface material. Additionally, the system should be designed to ensure good airflow and heat dissipation.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image LMR33630CDDAR Texas Instruments

Switching Regulator, Current-mode, 3A, 2100kHz Switching Freq-Max, PDSO8