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LMV226TLX/NOPB - Texas Instruments

Description: IC RF DETECTOR CDMA/WCDMA 4USMD

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PCB Footprints
LMV226TLX/NOPB - Texas Instruments PCB footprint - BGA - BGA - YZR0004
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3D Models
LMV226TLX/NOPB - Texas Instruments  - 3D model - BGA - YZR0004
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LMV226TLX/NOPB Details

  • Manufacturer Part Number:

    LMV226TLX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    R-XBGA-B4

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Supply Current-Max:

    8 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    RF AND BASEBAND CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

LMV226TLX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also important to follow general high-frequency PCB design guidelines, such as keeping the input and output traces short and away from each other, using a solid ground plane, and minimizing parasitic inductance and capacitance.
  • To ensure stability, it's essential to follow the recommended compensation network and component values, as well as to ensure that the output capacitor is properly sized and placed. Additionally, the input and output impedance of the amplifier should be matched to the source and load impedance, respectively.
  • The maximum power dissipation of the LMV226TLX/NOPB is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C, but this can be derated at higher temperatures. It's essential to ensure that the device is properly heat-sunk and that the thermal design is adequate for the specific application.
  • The LMV226TLX/NOPB is rated for operation up to 125°C, but the device's performance and reliability may be affected at higher temperatures. It's essential to consult the datasheet and to perform thorough testing and validation to ensure that the device meets the requirements of the specific application.
  • The LMV226TLX/NOPB has built-in ESD protection, but it's still essential to follow proper handling and assembly procedures to prevent damage. Additionally, it's recommended to use external protection devices, such as TVS diodes or zener diodes, to protect the device from overvoltage and ESD events.

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LMV226TLX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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