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LMV301SQ3T2G - onsemi

Description: Single Supply Operation (or #177;VS/2); VS from 1.8 V to 5 V

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LMV301SQ3T2G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - LMV301SQ3T2G
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LMV301SQ3T2G - onsemi  - 3D model - SOT23 (5-Pin) - LMV301SQ3T2G
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LMV301SQ3T2G Details

  • Manufacturer Part Number:

    LMV301SQ3T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88A (SC-70-5 / SOT-353)

  • Package Description:

    LEAD FREE, SC-70, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    419A-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.17

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.000035 µA

  • Common-mode Reject Ratio-Min:

    50 dB

  • Common-mode Reject Ratio-Nom:

    63 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    9000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    1.25 mm

LMV301SQ3T2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMV301SQ3T2G involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the op-amp. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • The LMV301SQ3T2G has built-in ESD protection, but additional protection measures can be taken. Use ESD-sensitive handling procedures, and consider adding external ESD protection devices, such as TVS diodes or ESD arrays, to protect the op-amp from electrostatic discharge.
  • The maximum power dissipation for the LMV301SQ3T2G is dependent on the ambient temperature and the thermal resistance of the package. A safe estimate is to limit the power dissipation to 500mW or less to ensure reliable operation.
  • The LMV301SQ3T2G is rated for operation up to 125°C, but the device's performance and reliability may degrade at high temperatures. Ensure proper thermal management and consider derating the device's specifications at high temperatures.
  • Choose bypass capacitors with a low equivalent series resistance (ESR) and a high self-resonant frequency. A 10nF to 100nF ceramic capacitor is a good starting point, but the optimal value depends on the specific application and PCB layout.

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LMV301SQ3T2G Overview

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