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LMV324IDG4 - Texas Instruments

Description: OP Amp Quad GP R-R O/P 5.5V 14-Pin SOIC Tube

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LMV324IDG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)
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LMV324IDG4 - Texas Instruments  - 3D model - Small Outline Packages - D (-R-PDSO-G14)
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LMV324IDG4 Details

  • Manufacturer Part Number:

    LMV324IDG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-14

  • Pin Count:

    14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.25 µA

  • Bias Current-Max (IIB) @25C:

    0.25 µA

  • Common-mode Reject Ratio-Min:

    50 dB

  • Common-mode Reject Ratio-Nom:

    65 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    1.16 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3.9 mm

LMV324IDG4 Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMV324IDG4 is dependent on the ambient temperature and the package thermal resistance. According to the datasheet, the maximum power dissipation is 670 mW at 25°C ambient temperature, but this can be derated to 500 mW at 50°C and 330 mW at 85°C.
  • While the LMV324IDG4 is an op-amp, it can be used as a comparator in certain applications. However, it's not recommended for high-speed or high-frequency comparator applications due to its limited slew rate and bandwidth. Additionally, the output stage is not designed for high-current drive, so it may not be suitable for driving heavy loads.
  • The input impedance of the LMV324IDG4 is typically around 10^12 ohms in parallel with 10 pF, according to the datasheet. This is a relatively high input impedance, making it suitable for high-impedance sources and minimizing the loading effect on the input signal.
  • Yes, the LMV324IDG4 can be used in a single-supply configuration, but the input common-mode voltage range is limited to within 1.5 V of the positive supply rail. This means that the input signal should be biased to be within this range to ensure proper operation.
  • The LMV324IDG4 has built-in ESD protection on the input pins, which can withstand up to 2 kV of electrostatic discharge according to the Human Body Model (HBM) and 200 V according to the Machine Model (MM). However, it's still recommended to follow proper ESD handling procedures when handling the device.

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LMV324IDG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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