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LMV358IDGKR - Texas Instruments

Description: OP Amp Dual GP R-R O/P 5.5V 8-Pin MSOP Texas Instruments LMV358IDGKR, Dual Op Amp, 1MHz CMOS, Rail to Rail, 3 V, 5 V, 8-Pin MSOP

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LMV358IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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LMV358IDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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LMV358IDGKR Details

  • Manufacturer Part Number:

    LMV358IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.25 µA

  • Bias Current-Max (IIB) @25C:

    0.25 µA

  • Common-mode Reject Ratio-Min:

    50 dB

  • Common-mode Reject Ratio-Nom:

    65 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.05 µA

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.44 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3 mm

LMV358IDGKR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMV358IDGKR is 670mW, which is calculated based on the maximum junction temperature (150°C) and the thermal resistance (125°C/W) of the package.
  • To ensure stability, it's essential to follow proper layout and grounding techniques, use a low-ESR capacitor for decoupling, and avoid capacitive loads. Additionally, consider adding a small capacitor (e.g., 10nF) in parallel with the feedback resistor to improve stability.
  • The recommended input voltage range for the LMV358IDGKR is between 1.5V and VCC-1.5V, where VCC is the supply voltage. Operating outside this range may affect the op-amp's performance and accuracy.
  • While the LMV358IDGKR can be used as a comparator, it's not the most suitable choice due to its relatively slow slew rate (0.5V/μs) and limited bandwidth (3MHz). A dedicated comparator like the LMV761 or LM339 would be a better option for most applications.
  • The LMV358IDGKR has internal ESD protection, but it's still essential to follow proper handling and storage procedures to prevent damage. Use an anti-static wrist strap or mat, and avoid touching the device's pins or exposed internal components.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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