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LMV358IDRG4 - Texas Instruments

Description: Dual Low-Voltage Rail-to-Rail Output Operational Amplifier - see LMV358A for upgraded version

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LMV358IDRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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LMV358IDRG4 - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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LMV358IDRG4 Details

  • Manufacturer Part Number:

    LMV358IDRG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Malaysia, Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.25 µA

  • Bias Current-Max (IIB) @25C:

    0.25 µA

  • Common-mode Reject Ratio-Min:

    50 dB

  • Common-mode Reject Ratio-Nom:

    65 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.05 µA

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    1 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.44 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3.9 mm

LMV358IDRG4 Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMV358IDRG4 is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • Yes, the LMV358IDRG4 is rated for operation from -40°C to 125°C, making it suitable for high-temperature applications. However, the maximum junction temperature (TJ) should not exceed 150°C.
  • To ensure stability, it's essential to follow proper PCB layout practices, use a low-ESR capacitor for decoupling, and avoid capacitive loading on the output. Additionally, consider adding a compensation capacitor (e.g., 10nF to 100nF) between the output and the inverting input to improve stability.
  • For optimal performance, use a star-grounding technique, where the grounds of the power supplies, analog circuits, and digital circuits are connected at a single point. Keep the layout compact, and use a ground plane to minimize noise and electromagnetic interference (EMI).
  • While the LMV358IDRG4 can be used as a comparator, it's not the most suitable choice due to its relatively slow slew rate (0.5V/μs) and limited bandwidth (3MHz). Consider using a dedicated comparator IC, such as the LMV761, for comparator applications.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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