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LMV358IDT - STMicroelectronics

Description: LMV358IDT, Dual Operational Amplifier 1.3MHz Rail-Rail, 3 V, 5 V, 8-Pin SO

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LMV358IDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO8 package outline
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LMV358IDT - STMicroelectronics  - 3D model - Small Outline Packages - SO8 package outline
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LMV358IDT Details

  • Manufacturer Part Number:

    LMV358IDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.75

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.095 µA

  • Bias Current-Max (IIB) @25C:

    0.063 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    8

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.45 V/us

  • Supply Current-Max:

    0.5 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1300

  • Voltage Gain-Min:

    3160

  • Wideband:

    NO

  • Width:

    3.9 mm

LMV358IDT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMV358IDT is 670mW, which is calculated based on the maximum junction temperature (150°C) and the thermal resistance (125°C/W) of the package.
  • To ensure stability, it's essential to add a capacitor (typically 10-100nF) between the output and the inverting input to compensate for the op-amp's internal capacitance and prevent oscillations.
  • To minimize noise and EMI, it's recommended to keep the input and output traces short and away from each other, use a ground plane, and add decoupling capacitors (e.g., 100nF) between the power supply pins and ground.
  • While the LMV358IDT can be used as a comparator, it's not the most suitable choice due to its relatively slow slew rate (0.5V/μs) and limited bandwidth (3MHz). A dedicated comparator like the LMV761 or LM2901 would be a better option.
  • To protect the LMV358IDT from overvoltage and ESD, add TVS (transient voltage suppression) diodes or ESD protection devices (e.g., 1.5KE6.8A) between the power supply pins and ground, and ensure that the input and output pins are not exposed to voltages exceeding the maximum ratings.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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