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LMV771MG - Texas Instruments

Description: Operational Amplifiers

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LMV771MG - Texas Instruments PCB footprint - Other - Other - SOT65P210X110-5N
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LMV771MG - Texas Instruments  - 3D model - Other - SOT65P210X110-5N
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LMV771MG Details

  • Manufacturer Part Number:

    LMV771MG

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SC-70, 5 PIN

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00025 µA

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Common-mode Reject Ratio-Min:

    79 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e0

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1.4 V/us

  • Supply Current-Max:

    0.96 mA

  • Supply Voltage Limit-Max:

    5.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    3500

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    1.25 mm

LMV771MG Frequently Asked Questions (FAQs)

  • To minimize noise and EMI, it is recommended to place the LMV771MG close to the signal source, use a ground plane, and keep the input and output traces short and away from each other. Additionally, decoupling capacitors should be placed close to the power pins, and the device should be oriented to minimize radiation.
  • The input bias current of the LMV771MG is typically very low, but it can still cause errors in high-impedance circuits. To minimize the effect of input bias current, use a low-impedance signal source, and consider using a bias current cancellation technique. The input offset voltage can be trimmed using an external potentiometer or by using a chopper-stabilized op-amp.
  • The LMV771MG can drive capacitive loads up to 1nF without oscillation, but the maximum capacitive load depends on the specific application and the desired stability margin. As a general rule, it is recommended to use a series resistor to isolate the capacitive load and ensure stability.
  • The LMV771MG has internal ESD protection, but it is still recommended to use external protection devices such as TVS diodes or zener diodes to protect against overvoltage and ESD events. Additionally, it is recommended to use a voltage limiter or a clamp circuit to prevent the input voltage from exceeding the maximum rating.
  • The thermal resistance of the LMV771MG package is typically around 30°C/W. To calculate the junction temperature, use the formula TJ = TA + (PD x θJA), where TJ is the junction temperature, TA is the ambient temperature, PD is the power dissipation, and θJA is the thermal resistance. It is recommended to keep the junction temperature below 150°C to ensure reliability and performance.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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