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LMV821M7/NOPB - Texas Instruments

Description: Texas Instruments LMV821M7/NOPB Low Power Op Amp, 5.6MHz Rail-Rail, 2.5 → 5.5 V, 5-Pin SC-70

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LMV821M7/NOPB - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DCK (R-PDSO-G5)
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LMV821M7/NOPB - Texas Instruments  - 3D model - SOT23 (5-Pin) - DCK (R-PDSO-G5)
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LMV821M7/NOPB Details

  • Manufacturer Part Number:

    LMV821M7/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.14 µA

  • Bias Current-Max (IIB) @25C:

    0.1 µA

  • Common-mode Reject Ratio-Min:

    72 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.03 µA

  • Input Offset Voltage-Max:

    3500 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    1.4 V/us

  • Slew Rate-Nom:

    2 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.4 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5600

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    1.25 mm

LMV821M7/NOPB Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMV821M7/NOPB is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, it's recommended to use a compensation capacitor (CC) between the output and the inverting input pins. The value of CC depends on the gain and bandwidth requirements of the application. A good starting point is to use a 10pF to 22pF capacitor.
  • To minimize noise and ensure optimal performance, it's recommended to follow a star-ground layout, keep the input and output traces short and separate, and use a solid ground plane. Additionally, place the decoupling capacitors as close to the op-amp as possible.
  • The LMV821M7/NOPB is rated for operation up to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. If your application requires operation above 125°C, consider using a different op-amp or implementing thermal management techniques.
  • The LMV821M7/NOPB has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the workspace is ESD-safe.

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LMV821M7/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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