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LMV881LEX/NOPB - Texas Instruments

Description: LMV881LEX/NOPB

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LMV881LEX/NOPB - Texas Instruments - PCB symbol
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PCB Footprints
LMV881LEX/NOPB - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - NKK0006A
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LMV881LEX/NOPB - Texas Instruments - 3D model - Small Outline No-lead - NKK0006A
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LMV881LEX/NOPB Details

  • Manufacturer Part Number:

    LMV881LEX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    79 dB

  • Common-mode Reject Ratio-Nom:

    94 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    R-XDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    1.5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC6,.04,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Slew Rate-Nom:

    12 V/us

  • Supply Current-Max:

    2.17 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    23000

  • Voltage Gain-Min:

    79430

  • Wideband:

    NO

  • Width:

    1 mm

LMV881LEX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-grounded layout, with the op-amp's ground pin connected to a central ground point. Additionally, keep the input and output traces short and away from noise sources, and use a solid ground plane to reduce electromagnetic interference (EMI).
  • Choose resistors with a tolerance of 1% or better, and ensure they are rated for the maximum voltage and power dissipation in your circuit. For high-frequency applications, use resistors with low parasitic inductance and capacitance. Consult the datasheet for recommended resistor values and ratios.
  • The maximum power dissipation for the LMV881LEX/NOPB is 670 mW. To calculate power dissipation, use the formula: Pd = (Vcc x Icc) + (Vout x Iout), where Vcc is the supply voltage, Icc is the quiescent current, Vout is the output voltage, and Iout is the output current.
  • The LMV881LEX/NOPB is rated for operation from -40°C to 125°C. However, the device's performance may degrade at high temperatures, and the maximum junction temperature (Tj) should not exceed 150°C. Consult the datasheet for thermal resistance and power dissipation derating information.
  • To ensure EMC, use a shielded enclosure, keep the op-amp's input and output traces short, and use a common-mode choke or ferrite bead on the input lines. Additionally, follow good PCB layout practices, such as separating analog and digital circuits, and using a solid ground plane.

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LMV881LEX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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