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LMX2306TM/NOPB - Texas Instruments

Description: National Semiconductor LMX2306TM/NOPB, PLL Frequency Synthesizer, 16-Pin TSSOP

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LMX2306TM/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead (0.173" Wide) Thin Shrink Small Outline Packag
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LMX2306TM/NOPB - Texas Instruments  - 3D model - Small Outline Packages - 16-Lead (0.173" Wide) Thin Shrink Small Outline Packag
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LMX2306TM/NOPB Details

  • Manufacturer Part Number:

    LMX2306TM/NOPB

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP,

  • Pin Count:

    16

  • Reach Compliance Code:

    Compliant

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    DUAL MODULUS PRESCALER: 8/9

  • Analog IC - Other Type:

    PLL FREQUENCY SYNTHESIZER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4.4 mm

LMX2306TM/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMX2306 should minimize noise and parasitic inductance. Place the device close to the power supply, use a solid ground plane, and keep the input and output traces short and separate. National Semiconductor provides a recommended PCB layout in their application notes.
  • To ensure stability, follow the recommended component values and PCB layout. Also, make sure the output capacitor is properly sized and placed close to the device. Additionally, check that the input voltage is within the recommended range and the device is not overheating.
  • Although the datasheet specifies a maximum input voltage of 6V, it's recommended to limit the input voltage to 5.5V to ensure reliable operation and prevent damage to the device.
  • The LMX2306 is rated for operation up to 125°C, but its performance may degrade at high temperatures. Ensure proper heat sinking and consider derating the device's output current and voltage to prevent overheating.
  • Use an oscilloscope to monitor the input and output voltages, as well as the switching node. Check for noise, ringing, or oscillations that may indicate a layout or component issue. Verify that the input voltage is within the recommended range and the device is not overheating.

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LMX2306TM/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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