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LMZ23605TZ/NOPB - Texas Instruments

Description: Texas Instruments, LMZ23605TZ/NOPB DC-DC Converter 5A Adjustable, 0.8 → 6 V, 7-Pin TO-PMOD

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PCB Footprints
LMZ23605TZ/NOPB - Texas Instruments PCB footprint - Other - Other - NDW0007A
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3D Models
LMZ23605TZ/NOPB - Texas Instruments  - 3D model - Other - NDW0007A
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LMZ23605TZ/NOPB Details

  • Manufacturer Part Number:

    LMZ23605TZ/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SIP

  • Pin Count:

    7

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    6 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PSSO-G7

  • JESD-609 Code:

    e3

  • Length:

    10.16 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    5 A

  • Output Voltage-Max:

    6 V

  • Output Voltage-Min:

    0.8 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    4.58 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    950 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9.85 mm

LMZ23605TZ/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMZ23605TZ/NOPB involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure the LMZ23605TZ/NOPB operates within its safe operating area (SOA), monitor the device's junction temperature, input voltage, and output current. Make sure the device is not exposed to excessive temperatures, and the input voltage and output current are within the recommended operating ranges.
  • The LMZ23605TZ/NOPB has a thermal pad that must be connected to a thermal plane on the PCB to improve heat dissipation. Use a thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device to improve thermal performance.
  • Yes, the LMZ23605TZ/NOPB is suitable for high-reliability applications. The device is qualified to automotive and industrial standards, and its reliability specifications include a mean time between failures (MTBF) of 10 million hours, and a failure rate of 10 FIT (failures per billion hours).
  • To troubleshoot common issues with the LMZ23605TZ/NOPB, check the input voltage, output current, and output voltage for any anomalies. Verify that the device is properly connected to the PCB, and that the input and output capacitors are of the correct value and type. Also, ensure that the device is not overheating, and that the thermal plane is properly connected.

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LMZ23605TZ/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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