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LMZ30604RKGR - Texas Instruments

Description: 2.95V to 6V, 4A Step-Down Power Module in 9x11x2.8mm QFN Package

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PCB Footprints
LMZ30604RKGR - Texas Instruments PCB footprint - Other - Other - RKG (R-PB1QFN-N39)_2021
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3D Models
LMZ30604RKGR - Texas Instruments  - 3D model - Other - RKG (R-PB1QFN-N39)_2021
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LMZ30604RKGR Details

  • Manufacturer Part Number:

    LMZ30604RKGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Input Voltage-Max:

    6 V

  • Input Voltage-Min:

    2.95 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    R-PQCC-N39

  • JESD-609 Code:

    e4

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    39

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    4 A

  • Output Voltage-Max:

    3.6 V

  • Output Voltage-Min:

    0.8 V

  • Output Voltage-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    LCC39,.35X.43,35

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.9 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2000 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.9 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

LMZ30604RKGR Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMZ30604RKGR involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, the output voltage should be set within the recommended range, and the input voltage should be within the specified operating range. It's also crucial to ensure that the device is operated within the recommended temperature range.
  • The LMZ30604RKGR can deliver up to 4A of output current. However, the maximum output current may be limited by the thermal performance of the device and the PCB. It's essential to ensure that the device is properly heatsinked and that the PCB is designed to handle the maximum output current.
  • The LMZ30604RKGR is rated for operation up to 125°C. However, the device's performance and reliability may be affected at high temperatures. It's essential to ensure that the device is properly heatsinked and that the PCB is designed to handle high temperatures. Additionally, the device's output current may need to be derated at high temperatures.
  • To troubleshoot issues with the LMZ30604RKGR, start by verifying that the device is properly powered and that the input voltage is within the specified range. Check the output voltage and current to ensure they are within the expected range. Use an oscilloscope to check for any oscillations or noise on the output. If the issue persists, check the PCB layout and component values to ensure they are correct.

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LMZ30604RKGR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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