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LMZ31503RUQR - Texas Instruments

Description: Non-Isolated DC/DC Converters 3A Power Module w/ 4.5V-14.5V Input

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PCB Footprints
LMZ31503RUQR - Texas Instruments PCB footprint - Other - Other - RUQ0047A
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3D Models
LMZ31503RUQR - Texas Instruments  - 3D model - Other - RUQ0047A
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LMZ31503RUQR Details

  • Manufacturer Part Number:

    LMZ31503RUQR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Input Voltage-Max:

    14.5 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PQCC-N47

  • JESD-609 Code:

    e4

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    47

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    5.5 V

  • Output Voltage-Min:

    0.8 V

  • Output Voltage-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    LCC47,.35X.59,35

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.9 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    780 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.9 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

LMZ31503RUQR Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the thermal vias are connected to the ground plane and that the component is placed near a thermal pad or heat sink.
  • To ensure a stable and accurate output voltage, it is essential to follow the recommended layout and component placement guidelines. Additionally, use a high-quality output capacitor with low ESR and a suitable voltage rating. Also, ensure that the input voltage is within the recommended range, and the output current is within the specified limits.
  • The recommended input capacitor type is a ceramic capacitor with an X7R or X5R dielectric. The value depends on the input voltage and output current requirements. A general guideline is to use a 10uF to 22uF capacitor with a voltage rating of 10V to 25V. However, it is recommended to consult the datasheet and application notes for specific guidance.
  • To protect the device from overvoltage and undervoltage conditions, it is recommended to use a voltage supervisor or a reset IC that can detect and respond to voltage faults. Additionally, consider using a TVS diode or a zener diode to clamp the input voltage and prevent damage to the device.
  • The recommended thermal management strategy involves using a heat sink or a thermal pad to dissipate heat efficiently. Ensure that the device is placed near a thermal pad or heat sink, and that the thermal interface material is of high quality. Additionally, consider using a fan or a heat pipe to enhance heat dissipation.

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LMZ31503RUQR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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