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LP2966IMM-2525/NOPB - Texas Instruments

Description: 150mA,2x2.5V,LDO Volt.Reg,LP2966IMM-2525

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LP2966IMM-2525/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK
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LP2966IMM-2525/NOPB Details

  • Manufacturer Part Number:

    LP2966IMM-2525/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.27 V

  • Dropout Voltage1-Nom:

    0.135 V

  • Dropout Voltage2-Max:

    0.27 V

  • Input Voltage Absolute-Max:

    7.5 V

  • Input Voltage-Max:

    7 V

  • Input Voltage-Min:

    2.7 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max:

    0.0025%

  • Load Regulation-Max:

    0.01%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Current2-Max:

    0.15 A

  • Output Voltage1-Max:

    2.5875 V

  • Output Voltage1-Min:

    2.4125 V

  • Output Voltage1-Nom:

    2.5 V

  • Output Voltage2-Max:

    2.5875 V

  • Output Voltage2-Min:

    2.4125 V

  • Output Voltage2-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3.5%

  • Width:

    3 mm

LP2966IMM-2525/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane and a thermal relief pattern around the device to ensure optimal thermal performance. A detailed layout guide can be found in the application note SLVA462.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, a minimum output capacitance of 10uF with an ESR of 1 ohm or less is recommended. A detailed stability analysis can be found in the application note SLVA463.
  • Although the datasheet specifies a maximum input voltage of 7V, it's recommended to limit the input voltage to 6.5V to ensure reliable operation and prevent damage to the device.
  • Yes, the device is rated for operation up to 125°C. However, it's essential to ensure that the device is properly heatsinked and that the thermal design is adequate to prevent overheating. A detailed thermal design guide can be found in the application note SLVA464.
  • A 1uF to 10uF ceramic capacitor with an X5R or X7R dielectric is recommended for input decoupling. The capacitor should be placed as close as possible to the input pin to minimize noise and ensure optimal performance.

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LP2966IMM-2525/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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