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LP5810BDSDR - Texas Instruments

Description: • Operating voltage range: – VCC range: 2.7 V to 5.5 V – Logic pins compatible with 1.8 V, 3.3 V, and 5 V • 4 constant current sinks with high precision: – 0.1-mA to 51-mA per current sink – Device-to-device error: max ±5% – Channel-to-channel error: max ±5% – Ultra-low headroom voltage: 110 mV (typ.) at 25.5 mA; 210 mV (typ.) at 51 mA – PWM phase shift configurable for each LED • Ultra-low power consumption: – Standby: ISTB = 26 μA (typical) when CHIP_EN = 0 (data retained) – Active: INOR = 0.

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LP5810BDSDR - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - DSD0008B-1
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LP5810BDSDR - Texas Instruments  - 3D model - Small Outline No-lead - DSD0008B-1
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LP5810BDSDR Details

  • Manufacturer Part Number:

    LP5810BDSDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SON-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Segments:

    4

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    0.65 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.6 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    2.7 V

  • Supply Voltage1-Nom:

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • fmax-Min:

    0.024 MHz

LP5810BDSDR Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the LP5810BDSDR. TI recommends a 4-layer PCB with a solid ground plane, and the use of vias to connect the top and bottom layers. Keep the input and output traces short and separate, and avoid routing them near the switching node.
  • The inductor value and type depend on the output voltage, current, and switching frequency. TI provides an inductor selection guide in the datasheet. For the LP5810BDSDR, a 2.2 μH to 4.7 μH inductor with a high saturation current rating is recommended.
  • Although the datasheet specifies a maximum input voltage of 15 V, it's recommended to limit the input voltage to 12 V to ensure reliable operation and prevent damage to the internal components.
  • The LP5810BDSDR has a built-in OCP feature that can be enabled by connecting the OCP pin to a resistor divider network. The OCP threshold can be set by adjusting the resistor values. TI provides a detailed OCP implementation guide in the datasheet.
  • A low-ESR ceramic or X5R/X7R capacitor with a value between 10 μF to 22 μF is recommended for the output filter. The capacitor value and type depend on the output voltage, current, and ripple requirements.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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