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LP5900SD-2.0/NOPB - Texas Instruments

Description: 150mA Ultralow-Noise LDO for RF and Analog Circuits Requires No Bypass Capacitor

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LP5900SD-2.0/NOPB - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - NGF0006A
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LP5900SD-2.0/NOPB - Texas Instruments  - 3D model - Small Outline No-lead - NGF0006A
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LP5900SD-2.0/NOPB Details

  • Manufacturer Part Number:

    LP5900SD-2.0/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    6

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustability:

    FIXED

  • Dropout Voltage1-Nom:

    0.08 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.5 V

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    2.5 mm

  • Line Regulation-Max:

    0.003%

  • Load Regulation-Max:

    0.00298%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    2.04 V

  • Output Voltage1-Min:

    1.96 V

  • Output Voltage1-Nom:

    2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.1,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    2.2 mm

LP5900SD-2.0/NOPB Frequently Asked Questions (FAQs)

  • The recommended input capacitor value is 1uF to 10uF, depending on the input voltage and output current requirements. A larger capacitor value can help to reduce input voltage ripple and improve output voltage regulation.
  • To ensure stability, it's essential to follow the recommended PCB layout guidelines, use a sufficient input capacitor, and add a 10nF to 100nF capacitor between the VOUT and GND pins. Additionally, avoid using long, thin traces and keep the output capacitor close to the VOUT pin.
  • The LP5900SD-2.0/NOPB can deliver up to 150mA of output current. However, the maximum output current may be limited by the input voltage, output voltage, and thermal considerations. It's essential to check the datasheet and perform thermal calculations to ensure the device can deliver the required output current.
  • The LP5900SD-2.0/NOPB has an operating junction temperature range of -40°C to 125°C. However, the device's performance and reliability may be affected at high temperatures. It's essential to perform thermal calculations and consider derating the output current to ensure reliable operation in high-temperature environments.
  • The power dissipation of the LP5900SD-2.0/NOPB can be calculated using the formula: Pd = (VIN - VOUT) x IOUT. Where Pd is the power dissipation, VIN is the input voltage, VOUT is the output voltage, and IOUT is the output current. It's essential to consider the power dissipation and thermal management to ensure reliable operation.

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LP5900SD-2.0/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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