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LP5900SDX-2.8/NOPB - Texas Instruments

Description: 150mA Ultralow-Noise LDO for RF and Analog Circuits Requires No Bypass Capacitor

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LP5900SDX-2.8/NOPB - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - NGF0006A
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LP5900SDX-2.8/NOPB - Texas Instruments  - 3D model - Small Outline No-lead - NGF0006A
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LP5900SDX-2.8/NOPB Details

  • Manufacturer Part Number:

    LP5900SDX-2.8/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.15 V

  • Dropout Voltage1-Nom:

    0.08 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.5 V

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    2.5 mm

  • Line Regulation-Max:

    0.0042%

  • Load Regulation-Max:

    0.0041%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    2.856 V

  • Output Voltage1-Min:

    2.744 V

  • Output Voltage1-Nom:

    2.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.1,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    2.2 mm

LP5900SDX-2.8/NOPB Frequently Asked Questions (FAQs)

  • The recommended input capacitor value is 1uF to 10uF, depending on the input voltage and output current requirements. A larger capacitor value can help to reduce input voltage ripple and improve output voltage regulation.
  • To ensure stability, it's essential to follow the recommended PCB layout guidelines, use a sufficient output capacitor value, and ensure that the input voltage is within the recommended range. Additionally, adding a small ceramic capacitor (e.g., 10nF) between the VIN and GND pins can help to reduce noise and prevent oscillations.
  • The maximum output current of LP5900SDX-2.8/NOPB is 150mA. However, the actual output current may be limited by the input voltage, output voltage, and thermal considerations. It's essential to check the device's thermal performance and power dissipation to ensure reliable operation.
  • The LP5900SDX-2.8/NOPB is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to check the device's thermal performance and power dissipation to ensure reliable operation in high-temperature environments.
  • The power dissipation of LP5900SDX-2.8/NOPB can be calculated using the formula: Pd = (VIN - VOUT) x IOUT + (VIN x IQ), where Pd is the power dissipation, VIN is the input voltage, VOUT is the output voltage, IOUT is the output current, and IQ is the quiescent current. It's essential to check the device's thermal performance and power dissipation to ensure reliable operation.

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LP5900SDX-2.8/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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