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LP5900TL-3.0/NOPB - Texas Instruments

Description: Texas Instruments LP5900TL-3.0/NOPB, LDO Voltage Regulator, 0.15A, 3 V ±2%, 2.5 → 5.5 Vin, 4-Pin μSMD

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PCB Footprints
LP5900TL-3.0/NOPB - Texas Instruments PCB footprint - BGA - BGA - YZR0004_1
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3D Models
LP5900TL-3.0/NOPB - Texas Instruments  - 3D model - BGA - YZR0004_1
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LP5900TL-3.0/NOPB Details

  • Manufacturer Part Number:

    LP5900TL-3.0/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.15 V

  • Dropout Voltage1-Nom:

    0.08 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.5 V

  • JESD-30 Code:

    R-PBGA-B4

  • JESD-609 Code:

    e1

  • Length:

    1.09 mm

  • Line Regulation-Max:

    0.0045%

  • Load Regulation-Max:

    0.00447%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    3.06 V

  • Output Voltage1-Min:

    2.94 V

  • Output Voltage1-Nom:

    3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.675 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    1.065 mm

LP5900TL-3.0/NOPB Frequently Asked Questions (FAQs)

  • The recommended input capacitor value is 1uF to 10uF, depending on the input voltage and output current requirements. A larger capacitor value can help to reduce input voltage ripple and improve output voltage regulation.
  • To ensure the LP5900TL-3.0/NOPB operates within its SOA, ensure that the input voltage, output current, and junction temperature are within the recommended operating conditions specified in the datasheet. Additionally, ensure that the device is properly heatsinked and that the thermal design is adequate for the application.
  • The maximum output current that the LP5900TL-3.0/NOPB can deliver is 3A. However, the actual output current capability may be limited by the input voltage, output voltage, and thermal design of the application.
  • The LP5900TL-3.0/NOPB is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may be affected at high temperatures. It is recommended to derate the output current and ensure proper thermal design to ensure reliable operation in high-temperature environments.
  • To minimize noise and ensure reliable operation of the LP5900TL-3.0/NOPB, follow good PCB layout practices such as separating analog and digital grounds, using a solid ground plane, and minimizing trace lengths and loops. Additionally, ensure that the input and output capacitors are placed close to the device and that the PCB is designed to minimize electromagnetic interference (EMI).

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LP5900TL-3.0/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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