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LP5951MF-2.0/NOPB - Texas Instruments

Description: Micropower 150mA Low-Dropout (LDO) CMOS Voltage Regulator

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PCB Footprints
LP5951MF-2.0/NOPB - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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LP5951MF-2.0/NOPB - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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LP5951MF-2.0/NOPB Details

  • Manufacturer Part Number:

    LP5951MF-2.0/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.35 V

  • Dropout Voltage1-Nom:

    0.2 V

  • Input Voltage Absolute-Max:

    6.5 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.8 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Line Regulation-Max:

    0.0074%

  • Load Regulation-Max:

    0.0298%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    2.04 V

  • Output Voltage1-Min:

    1.96 V

  • Output Voltage1-Nom:

    2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.45 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.953 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3.5%

  • Width:

    1.6 mm

LP5951MF-2.0/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good copper pour connectivity to dissipate heat. A 2-layer or 4-layer PCB with a solid ground plane is recommended.
  • To ensure reliable operation in high-temperature environments, ensure that the device is properly heatsinked, and the thermal pad is connected to a solid ground plane. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The recommended input capacitor is a 10uF ceramic capacitor with X5R or X7R dielectric, and the recommended output capacitor is a 22uF ceramic capacitor with X5R or X7R dielectric. These capacitors should be placed as close to the device as possible.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output voltage, and output current. Verify that the input voltage is within the recommended range, and that the output voltage is within the specified tolerance. Also, check for any signs of overheating or excessive current draw.
  • Operating the device beyond its recommended operating conditions can lead to reduced reliability, decreased performance, and increased risk of failure. It may also void the device's warranty. Always operate the device within its recommended operating conditions to ensure reliable and safe operation.

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LP5951MF-2.0/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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For a full list of alternate parts for LP5951MF-2.0/NOPB, check out Findchips.com