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LP5951MG-2.8/NOPB - Texas Instruments

Description: Micropower 150mA Low-Dropout (LDO) CMOS Voltage Regulator

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LP5951MG-2.8/NOPB - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DCK(R-PDSO-G5)
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LP5951MG-2.8/NOPB - Texas Instruments  - 3D model - SOT23 (5-Pin) - DCK(R-PDSO-G5)
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LP5951MG-2.8/NOPB Details

  • Manufacturer Part Number:

    LP5951MG-2.8/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.25 V

  • Dropout Voltage1-Nom:

    0.2 V

  • Input Voltage Absolute-Max:

    6.5 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.8 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Line Regulation-Max:

    0.01036%

  • Load Regulation-Max:

    0.04172%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    2.856 V

  • Output Voltage1-Min:

    2.744 V

  • Output Voltage1-Nom:

    2.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3.5%

  • Width:

    1.25 mm

LP5951MG-2.8/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to improve heat dissipation. A minimum of 1 oz copper thickness is recommended for the top and bottom layers.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the output current and voltage according to the thermal derating curve provided in the datasheet. Additionally, ensure good airflow and thermal management around the device.
  • Texas Instruments recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for optimal performance. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ripple.
  • To troubleshoot output voltage instability or oscillation issues, check the PCB layout for any signs of noise or ringing, ensure that the input capacitor is properly sized and placed, and verify that the output capacitor is properly sized and has a low ESR. Also, check for any signs of thermal issues or overheating.
  • Texas Instruments recommends using a low-ESR ceramic capacitor with a value of 10uF to 47uF for optimal performance. The capacitor should be placed as close as possible to the VOUT pin to minimize noise and ripple.

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LP5951MG-2.8/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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