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LP5951MGX-3.0/NOPB - Texas Instruments

Description: Micropower 150mA Low-Dropout (LDO) CMOS Voltage Regulator

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LP5951MGX-3.0/NOPB - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DCK (R-PDSO-G5)
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LP5951MGX-3.0/NOPB - Texas Instruments  - 3D model - SOT23 (5-Pin) - DCK (R-PDSO-G5)
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LP5951MGX-3.0/NOPB Details

  • Manufacturer Part Number:

    LP5951MGX-3.0/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.25 V

  • Dropout Voltage1-Nom:

    0.2 V

  • Input Voltage Absolute-Max:

    6.5 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.8 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Line Regulation-Max:

    0.0111%

  • Load Regulation-Max:

    0.0447%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    3.06 V

  • Output Voltage1-Min:

    2.94 V

  • Output Voltage1-Nom:

    3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3.5%

  • Width:

    1.25 mm

LP5951MGX-3.0/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer to improve thermal performance. Additionally, it's recommended to use thermal vias to connect the exposed pad to the ground plane.
  • To ensure stable and accurate output voltage, it's essential to use a high-quality output capacitor with low ESR (Equivalent Series Resistance) and a sufficient capacitance value (at least 10uF). Additionally, the input voltage should be well-regulated, and the device should be operated within the recommended operating conditions.
  • Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and to prevent damage to the device.
  • The LP5951MGX-3.0/NOPB is rated for operation up to 125°C, but it's essential to consider the device's power dissipation and thermal management when operating in high-temperature environments. Ensure that the device is properly heatsinked, and the PCB is designed to handle high temperatures.
  • To troubleshoot output voltage errors or instability, check the input voltage, output capacitor value and quality, and the PCB layout. Ensure that the device is operated within the recommended operating conditions, and the output voltage is within the specified range. Use an oscilloscope to measure the output voltage and check for any noise or oscillations.

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LP5951MGX-3.0/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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