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LP8501TME/NOPB - Texas Instruments

Description: Multi-Purpose 9-Output LED Driver

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Symbol
LP8501TME/NOPB - Texas Instruments - PCB symbol
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PCB Footprints
LP8501TME/NOPB - Texas Instruments PCB footprint - BGA - BGA - YFQ0025_2021
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3D Models
LP8501TME/NOPB - Texas Instruments - 3D model - BGA - YFQ0025_2021
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LP8501TME/NOPB Details

  • Manufacturer Part Number:

    LP8501TME/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-XBGA-B25

  • JESD-609 Code:

    e1

  • Length:

    2.26 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Channels:

    9

  • Number of Functions:

    1

  • Number of Segments:

    9

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA25,5X5,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.675 mm

  • Supply Current-Max:

    0.001 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Nom:

    3.6 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Nom:

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.26 mm

LP8501TME/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer to improve thermal performance. Additionally, it's recommended to have a minimum of 2 oz copper thickness and to use thermal vias to connect the thermal pad to the ground plane.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines. This includes providing adequate heat sinking, using a thermal interface material (TIM) between the device and heat sink, and ensuring good airflow around the device.
  • The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the device. It's recommended to use a voltage limiter or a voltage divider to ensure the EN pin voltage remains within the specified range.
  • Yes, the LP8501TME/NOPB is suitable for battery-powered devices. It has a low quiescent current (IQ) of 1.5mA, which helps to extend battery life. However, it's essential to consider the device's power consumption and battery life requirements when designing the system.
  • To troubleshoot issues with the LP8501TME/NOPB, start by checking the device's input and output voltages, as well as the EN pin voltage. Verify that the device is properly connected and that the PCB layout meets the recommended guidelines. If issues persist, consult the datasheet and application notes for troubleshooting guidance.

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LP8501TME/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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