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LP8553TLE/NOPB - Texas Instruments

Description: High-Efficiency LED Backlight Driver for Notebooks

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PCB Footprints
LP8553TLE/NOPB - Texas Instruments PCB footprint - BGA - BGA - YZR0025 _2021
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3D Models
LP8553TLE/NOPB - Texas Instruments  - 3D model - BGA - YZR0025 _2021
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LP8553TLE/NOPB Details

  • Manufacturer Part Number:

    LP8553TLE/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-PBGA-B25

  • JESD-609 Code:

    e1

  • Length:

    2.46 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Segments:

    4

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA25,5X5,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.675 mm

  • Supply Current-Max:

    0.001 mA

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    5.5 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    5 V

  • Supply Voltage1-Min:

    1.65 V

  • Supply Voltage1-Nom:

    2.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.46 mm

  • fmax-Min:

    1.25 MHz

LP8553TLE/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer to improve thermal performance. Additionally, it's recommended to have a minimum of 2 vias under the device to connect the thermal pad to the ground plane.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal management. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The recommended input capacitor value is 10uF to 22uF, with a low ESR (Equivalent Series Resistance) and a voltage rating of at least 6.3V. A ceramic or tantalum capacitor is recommended due to their low ESR and high reliability.
  • To troubleshoot issues with the device not turning on or not regulating properly, check the input voltage, output voltage, and enable pin voltage using an oscilloscope or multimeter. Ensure that the input voltage is within the recommended range, and the enable pin is properly biased. Also, verify that the output capacitor value and type meet the recommended specifications.
  • The recommended output capacitor value is 10uF to 22uF, with a low ESR and a voltage rating of at least 2.5V. A ceramic or tantalum capacitor is recommended due to their low ESR and high reliability. The output capacitor should be placed as close as possible to the output pin of the device.

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LP8553TLE/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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