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LP8556TMX-E06/NOPB - Texas Instruments

Description: 6 Channel High-Efficiency/Efficacy LED Backlight Driver

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LP8556TMX-E06/NOPB - Texas Instruments - PCB symbol
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LP8556TMX-E06/NOPB - Texas Instruments PCB footprint - BGA - BGA - YFQ0020x_2021
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LP8556TMX-E06/NOPB - Texas Instruments - 3D model - BGA - YFQ0020x_2021
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LP8556TMX-E06/NOPB Details

  • Manufacturer Part Number:

    LP8556TMX-E06/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Input Mode:

    SERIAL

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-XBGA-B20

  • JESD-609 Code:

    e1

  • Length:

    2.371 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Channels:

    6

  • Number of Functions:

    1

  • Number of Segments:

    12

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA20,4X5,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.675 mm

  • Supply Current-Max:

    3.65 mA

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.71 mm

  • fmax-Min:

    1.25 MHz

LP8556TMX-E06/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer to improve thermal performance. Additionally, it's recommended to have a minimum of 2 vias under the device to connect the thermal pad to the ground plane.
  • The LP8556TMX-E06/NOPB has a power-on reset (POR) circuit that ensures the device is properly powered up and configured during startup. However, it's recommended to add an external capacitor between the VCC and GND pins to filter out any noise and ensure a clean power-up sequence.
  • The LP8556TMX-E06/NOPB can sink up to 10mA of current per output pin. However, it's recommended to limit the current to 5mA or less to ensure reliable operation and prevent overheating.
  • To troubleshoot I2C interface issues, use a logic analyzer or oscilloscope to verify the clock and data signals. Ensure that the I2C bus is properly terminated and that the device is properly addressed. Also, check the device's status registers to identify any error conditions.
  • The LP8556TMX-E06/NOPB is rated for operation from -40°C to 85°C. However, it's recommended to operate the device within a temperature range of 0°C to 70°C for optimal performance and reliability.

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LP8556TMX-E06/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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