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LP87702KRHBRQ1 - Texas Instruments

Description: Switching Voltage Regulators Dual buck converter and 5-V boost with diagnostic functions 32-VQFN -40 to 125

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LP87702KRHBRQ1 - Texas Instruments - PCB symbol
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PCB Footprints
LP87702KRHBRQ1 - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RHB0032N
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LP87702KRHBRQ1 - Texas Instruments - 3D model - Quad Flat No-Lead - RHB0032N
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LP87702KRHBRQ1 Details

  • Manufacturer Part Number:

    LP87702KRHBRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2019-12-21

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES IN PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.8 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    3

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3.5 A

  • Output Voltage-Max:

    5.2 V

  • Output Voltage-Min:

    0.7 V

  • Output Voltage-Nom:

    1 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100; ATEX

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    4000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

LP87702KRHBRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer to improve thermal performance. Additionally, it's recommended to have a minimum of 2 vias under the device to connect the thermal pad to the ground plane.
  • To ensure proper power-up and configuration, it's recommended to follow the power-up sequence outlined in the datasheet. This includes applying a valid input voltage, waiting for the internal voltage regulator to stabilize, and then configuring the device through the I2C interface.
  • The maximum current draw from the output rails depends on the specific configuration and application. The datasheet provides guidelines for calculating the maximum current draw and power dissipation. It's recommended to use the TI Power Estimator tool to estimate the power dissipation and ensure the device is properly sized for the application.
  • To troubleshoot I2C interface issues, use a logic analyzer or oscilloscope to monitor the I2C bus signals. Check for bus contention by verifying that only one device is driving the bus at a time. For clock stretching issues, ensure that the device is properly configured to handle clock stretching and that the I2C clock frequency is within the recommended range.
  • Texas Instruments recommends using ceramic capacitors with a value of 10uF to 22uF for decoupling the input and output rails. The capacitors should be placed as close as possible to the device pins and have a low equivalent series resistance (ESR) to ensure effective decoupling.

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LP87702KRHBRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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