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LP8863ADCPRQ1 - Texas Instruments

Description: LED Lighting Drivers LP8863-Q1 Automotive Display LED-Backlight Driver With Six 150-mA Channels 38-HTSSOP -40 to 125

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LP8863ADCPRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DCP (R-PDSO-G38)
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LP8863ADCPRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DCP (R-PDSO-G38)
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LP8863ADCPRQ1 Details

  • Manufacturer Part Number:

    LP8863ADCPRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2017-05-28

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Input Mode:

    SERIAL

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G38

  • JESD-609 Code:

    e4

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    YES

  • Number of Channels:

    6

  • Number of Functions:

    1

  • Number of Segments:

    30

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    48 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    2.7 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    2.2 MHz

LP8863ADCPRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the LP8863ADCPRQ1 involves separating analog and digital grounds, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper configuration, review the datasheet and application notes, and consult with Texas Instruments' support resources. Additionally, use the TI's WEBENCH Power Designer tool to simulate and optimize your design.
  • The LP8863ADCPRQ1 has a thermal pad that must be connected to a thermal plane on the PCB. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Monitor the device's junction temperature and adjust the design accordingly.
  • Use a systematic approach to troubleshoot issues: review the datasheet, check the PCB layout, verify the input and output connections, and use oscilloscopes or logic analyzers to debug the issue. Consult with Texas Instruments' support resources if necessary.
  • Follow proper PCB layout and design practices to minimize EMI. Use shielding, filtering, and grounding techniques to reduce emissions. Ensure compliance with regulatory standards such as CISPR and FCC by performing EMI and EMC testing.

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LP8863ADCPRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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