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LP9435LT1G - LRC

Description: 30V P-Channel Enhancement-Mode MOSFET

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PCB Footprints
LP9435LT1G - LRC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23(TO-236)_2022
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3D Models
LP9435LT1G - LRC  - 3D model - SOT23 (3-Pin) - SOT23(TO-236)_2022
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LP9435LT1G Details

  • Manufacturer Part Number:

    LP9435LT1G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    LRC Leshan Radio Co Ltd

  • YTEOL:

    5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    5.3 A

  • Drain-source On Resistance-Max:

    0.07 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    51 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.4 W

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

LP9435LT1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves keeping the input and output traces separate, using a solid ground plane, and placing the device near a heat sink or thermal pad. A thermal management strategy should include a heat sink or thermal pad, and ensuring good airflow around the device.
  • To ensure reliability and longevity, operate the device within the recommended temperature range, use a heat sink or thermal pad, and implement over-temperature protection. Additionally, follow proper soldering and assembly techniques, and store the device in a dry, cool environment.
  • To minimize EMI and RFI, use a shielded enclosure, keep the device away from antennas and high-frequency components, and use filtering or shielding on the input and output lines. Additionally, follow good PCB layout practices, such as separating analog and digital traces.
  • Yes, the LP9435LT1G can be used in a switching regulator application. However, ensure that the device is properly bypassed, and the input and output capacitors are selected to handle the high-frequency switching. Additionally, consider the device's power rating and thermal management in the switching regulator design.
  • The recommended input capacitor is a low-ESR, high-frequency capacitor (e.g., ceramic or film capacitor) with a value between 1-10uF. The recommended output capacitor is a low-ESR, high-frequency capacitor with a value between 10-100uF. The capacitor selection should consider the device's operating frequency, output current, and ripple requirements.

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LP9435LT1G Overview

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