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LPC1114FBD48/302,1 - NXP

Description: ARM Microcontrollers - MCU 32b 32K Flash 42I/O

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PCB Footprints
LPC1114FBD48/302,1 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2
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3D Models
LPC1114FBD48/302,1 - NXP  - 3D model - Quad Flat Packages - LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for LPC1114FBD48/302,1
  • Part Number LPC1114FBD48/302,1
  • Manufacturer NXP
  • Pin Count 48
  • Part Category Integrated Circuit
  • Package Category Quad Flat Packages
  • Footprint Name Quad Flat Packages - LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2
  • Released Date Jul 24, 2020
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

LPC1114FBD48/302,1 Details

  • Manufacturer Part Number:

    LPC1114FBD48/302,1

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    48

  • Manufacturer Package Code:

    SOT313-2

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    1

  • Number of I/O Lines:

    42

  • Number of Terminals:

    48

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    8192

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    50 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC1114FBD48/302,1 Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the LPC1114FBD48/302 is 50 MHz.
  • The LPC1114FBD48/302 has 48 KB of flash memory.
  • The operating voltage range of the LPC1114FBD48/302 is 1.8V to 3.6V.
  • Yes, the LPC1114FBD48/302 has a built-in USB 2.0 full-speed device controller.
  • The power consumption of the LPC1114FBD48/302 in sleep mode is typically around 2.4 μA.

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LPC1114FBD48/302,1 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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