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LPC11U24FHI33 - NXP

Description:  ARM Cortex-M0 processor, running at frequencies of up to 50 MHz.  ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC).  Non-Maskable Interrupt (NMI) input selectable from several input sources.  System tick timer.  Memory:  Up to 32 kB on-chip flash program memory.  Up to 4 kB on-chip EEPROM data memory; byte erasable and byte programmable.  Up to 10 kB SRAM data memory.  16 kB boot ROM.  In-System Programming (ISP) and In-Application Programming (IAP) for flash and EEPRO

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PCB Footprints
LPC11U24FHI33 - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN33 (5 x 5 x 0.85 mm)
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3D Models
LPC11U24FHI33 - NXP  - 3D model - Quad Flat No-Lead - HVQFN33 (5 x 5 x 0.85 mm)
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LPC11U24FHI33 Details

  • Manufacturer Part Number:

    LPC11U24FHI33

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-32

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Additional Feature:

    SEATED HGT-NOM

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N32

  • Length:

    5 mm

  • Low Power Mode:

    YES

  • Number of I/O Lines:

    26

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    32

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • RAM (bytes):

    8192

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.85 mm

  • Speed:

    50 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

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LPC11U24FHI33 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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