LPC1226FBD64/301 - NXP

LPC1226FBD64/301 Details

• Manufacturer Part Number:

  LPC1226FBD64/301

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  QFP

• Package Description:

  10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT314-2, LQFP-64

• Pin Count:

  64

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  8

• Has ADC:

  YES

• Bit Size:

  32

• Boundary Scan:

  NO

• Clock Frequency-Max:

  25 MHz

• DAC Channels:

  NO

• DMA Channels:

  YES

• JESD-30 Code:

  S-PQFP-G64

• Length:

  10 mm

• Moisture Sensitivity Level:

  1

• Number of I/O Lines:

  55

• Number of Terminals:

  64

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  NO

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFQFP

• Package Shape:

  SQUARE

• Package Style:

  FLATPACK

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• ROM (words):

  131072

• ROM Programmability:

  FLASH

• Seated Height-Max:

  1.6 mm

• Speed:

  45 MHz

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  3 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Width:

  10 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC