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LPC1342FHN33,551 - NXP

Description: 32-bit ARM Cortex-M3 microcontroller up to 32 kB flash and8 kB SRAM USB device

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PCB Footprints
LPC1342FHN33,551 - NXP PCB footprint - Other - Other - QFN65P700X700X100-33N
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3D Models
LPC1342FHN33,551 - NXP  - 3D model - Other - QFN65P700X700X100-33N
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LPC1342FHN33,551 Details

  • Manufacturer Part Number:

    LPC1342FHN33,551

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    QFN

  • Package Description:

    HVQFN-33

  • Pin Count:

    32

  • Manufacturer Package Code:

    SOT865-3

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    ARM7

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQCC-N33

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    26

  • Number of Terminals:

    33

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.27SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    4096

  • ROM (words):

    16384

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    72 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

LPC1342FHN33,551 Frequently Asked Questions (FAQs)

  • The recommended crystal oscillator frequency for the LPC1342FHN33 is 12 MHz. However, the device can operate with a crystal frequency between 1 MHz and 25 MHz.
  • The boot mode of the LPC1342FHN33 can be configured by setting the ISP pin (P1.10) high or low during reset. If ISP is high, the device boots from the internal flash. If ISP is low, the device boots from the external flash or serial interface.
  • The maximum operating temperature range for the LPC1342FHN33 is -40°C to +85°C. However, the device can operate at a reduced frequency and voltage at higher temperatures.
  • The LPC1342FHN33 has a built-in watchdog timer that can be enabled and configured using the WDT registers. The watchdog timer can be fed by the system clock or an external clock source, and can be used to reset the device in case of a software fault.
  • The maximum current consumption of the LPC1342FHN33 depends on the operating frequency, voltage, and peripherals used. However, the typical current consumption is around 10 mA at 48 MHz and 3.3 V.

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LPC1342FHN33,551 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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