28 X 28 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT459-1, LQFP-208
Pin Count:
208
Country Of Origin:
Taiwan
ECCN Code:
3A991.A.2
HTS Code:
8542.31.00.25
Manufacturer:
NXP Semiconductors
YTEOL:
5
Has ADC:
YES
Address Bus Width:
26
Bit Size:
32
Boundary Scan:
YES
Clock Frequency-Max:
25 MHz
DAC Channels:
YES
DMA Channels:
YES
External Data Bus Width:
32
JESD-30 Code:
S-PQFP-G208
JESD-609 Code:
e3
Length:
28 mm
Moisture Sensitivity Level:
2
Number of I/O Lines:
165
Number of Terminals:
208
On Chip Program ROM Width:
8
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
PWM Channels:
YES
Package Body Material:
PLASTIC/EPOXY
Package Code:
LFQFP
Package Equivalence Code:
QFP208,1.2SQ,20
Package Shape:
SQUARE
Package Style:
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
RAM (bytes):
81920
ROM (words):
262144
ROM Programmability:
FLASH
Seated Height-Max:
1.6 mm
Speed:
120 MHz
Supply Current-Max:
100 mA
Supply Voltage-Max:
3.6 V
Supply Voltage-Min:
3.3 V
Supply Voltage-Nom:
3.3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
28 mm
uPs/uCs/Peripheral ICs Type:
MICROCONTROLLER, RISC
LPC1776FBD208 Frequently Asked Questions (FAQs)
The maximum operating temperature range for the LPC1776FBD208 is -40°C to +105°C, but this can be extended to -40°C to +125°C for some packages and with certain limitations.
The clock settings for the LPC1776FBD208 can be configured using the Clock Generation Unit (CGU) and the Power Management Unit (PMU). The CGU generates the clock signals for the processor and peripherals, while the PMU controls the power modes and clock gating.
The maximum frequency for the LPC1776FBD208 is 120 MHz, but this can be limited by the specific package and operating conditions.
The ADC on the LPC1776FBD208 is a 12-bit successive approximation ADC with up to 8 channels. It can be configured using the ADC registers and can operate in various modes, including single-shot, continuous, and burst modes.
The Boot ROM on the LPC1776FBD208 is a 32 KB ROM that contains a boot loader and a set of APIs for booting and configuring the device. It can be used to load the application code from an external memory device or to perform other boot-related tasks.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
LPC1776FBD208 Overview
Use the download button to access the LPC1776FBD208 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like LPC17,
or try a keyword search, such as Microcontrollers
About NXP
NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more.
NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.
