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LPC1837FET256,551 - NXP

Description: NXP - LPC1837FET256,551 - ARM MCU, LPC Family LPC1800 Series Microcontrollers, ARM Cortex-M3, 32bit, 180 MHz, 1 MB, 136 KB

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PCB Footprints
LPC1837FET256,551 - NXP PCB footprint - BGA - BGA - LPC1837FET256,551
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3D Models
LPC1837FET256,551 - NXP  - 3D model - BGA - LPC1837FET256,551
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LPC1837FET256,551 Details

  • Manufacturer Part Number:

    LPC1837FET256,551

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    256

  • Manufacturer Package Code:

    SOT740-2

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M3

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    164

  • Number of Terminals:

    256

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    139264

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Speed:

    180 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.2 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC1837FET256,551 Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the LPC1837FET256,551 is 180 MHz.
  • The LPC1837FET256,551 has 1 MB of flash memory.
  • The LPC1837FET256,551 has 136 KB of SRAM.
  • Yes, the LPC1837FET256,551 has a USB 2.0 full-speed device controller with on-chip PHY.
  • The power consumption of the LPC1837FET256,551 varies depending on the operating frequency and mode, but it can be as low as 20 μA/MHz in active mode and 2.5 μA in sleep mode.

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LPC1837FET256,551 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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