LPC18S30FBD144 - NXP

LPC18S30FBD144 Details

• Manufacturer Part Number:

  LPC18S30FBD144

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  LQFP-144

• Country Of Origin:

  Taiwan

• ECCN Code:

  5A992

• HTS Code:

  8542.31.00.25

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  5

• Has ADC:

  YES

• Address Bus Width:

  16

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  CORTEX-M3

• Clock Frequency-Max:

  25 MHz

• DAC Channels:

  YES

• DMA Channels:

  YES

• External Data Bus Width:

  16

• Format:

  FIXED POINT

• Integrated Cache:

  NO

• JESD-30 Code:

  S-PQFP-G144

• Length:

  20 mm

• Low Power Mode:

  YES

• Number of DMA Channels:

  8

• Number of I/O Lines:

  83

• Number of Serial I/Os:

  8

• Number of Terminals:

  144

• Number of Timers:

  7

• On Chip Data RAM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFQFP

• Package Equivalence Code:

  QFP144,.87SQ,20

• Package Shape:

  SQUARE

• Package Style:

  FLATPACK, LOW PROFILE, FINE PITCH

• RAM (bytes):

  204800

• ROM (words):

  0

• Seated Height-Max:

  1.6 mm

• Speed:

  180 MHz

• Supply Current-Max:

  100 mA

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  2.2 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Width:

  20 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC