Part Image

LPC2109FBD64/01,15 - NXP

Description: NXP LPC2109FBD64/01,15, 16/32bit ARM7TDMI-S Microcontroller, 60MHz, 64 kB Flash, 64-Pin LQFP

Download LPC2109FBD64/01,15 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
LPC2109FBD64/01,15 - NXP PCB footprint - Other - Other - QFP50P1200X1200X160-64N-ren1
click to zoom
3D Models
LPC2109FBD64/01,15 - NXP  - 3D model - Other - QFP50P1200X1200X160-64N-ren1
click to zoom

LPC2109FBD64/01,15 Details

  • Manufacturer Part Number:

    LPC2109FBD64/01,15

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT314-2, LQFP-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    SOT314-2

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    ALSO REQUIRES 3.3V SUPPLY

  • Bit Size:

    32

  • CPU Family:

    ARM7

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    1

  • Number of I/O Lines:

    46

  • Number of Terminals:

    64

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    8192

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    60 MHz

  • Supply Voltage-Max:

    1.95 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC2109FBD64/01,15 Frequently Asked Questions (FAQs)

  • The maximum clock frequency for the LPC2109 is 60 MHz, but it can be overclocked to 70 MHz with some limitations.
  • The pin multiplexing on the LPC2109 is configured using the PINSEL registers, which allow you to select the function of each pin. The specific configuration depends on the peripheral and pin being used.
  • The maximum current that can be sourced or sunk by the GPIO pins on the LPC2109 is 4 mA per pin, with a total current limit of 100 mA for all GPIO pins combined.
  • The ADC on the LPC2109 is a 10-bit successive approximation ADC. To use it, you need to configure the ADC clock, select the ADC channel, and start the conversion. You can then read the conversion result from the ADC register.
  • The bootloader on the LPC2109 is used to load the application code into the microcontroller's flash memory. It can be used to update the firmware in the field or to load a new application.

Trust Checks

This model has been verified by system checks.
System Verified
Sponsored

LPC2109FBD64/01,15 Overview

Use the download button to access the LPC2109FBD64/01,15 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LPC21, or try a keyword search, such as Microcontrollers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

Parts related to LPC2109FBD64/01,15

Showing 0 results