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LPC2148FBD64,118 - NXP

Description: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm

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PCB Footprints
LPC2148FBD64,118 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm_(SOT314-2)
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LPC2148FBD64,118 - NXP  - 3D model - Quad Flat Packages - LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm_(SOT314-2)
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for LPC2148FBD64,118
  • Part Number LPC2148FBD64,118
  • Manufacturer NXP
  • Pin Count 64
  • Part Category Integrated Circuit
  • Package Category Quad Flat Packages
  • Footprint Name Quad Flat Packages - LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm_(SOT314-2)
  • Released Date Jun 1, 2022
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

LPC2148FBD64,118 Details

  • Manufacturer Part Number:

    LPC2148FBD64,118

  • Source Url Status Check Date:

    2013-10-15 00:00:00

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    SOT314-2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Has ADC:

    YES

  • Bit Size:

    32

  • CPU Family:

    ARM7

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e2

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    1

  • Number of I/O Lines:

    45

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    40960

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    60 MHz

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

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LPC2148FBD64,118 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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