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LPC2292FBD144,551 - NXP

Description: IC MCU 16/32B 256KB FLSH 144LQFP

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LPC2292FBD144,551 - NXP - PCB symbol
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PCB Footprints
LPC2292FBD144,551 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
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3D Models
LPC2292FBD144,551 - NXP - 3D model - Quad Flat Packages - LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for LPC2292FBD144,551
  • Part Number LPC2292FBD144,551
  • Manufacturer NXP
  • Pin Count 144
  • Part Category Integrated Circuit
  • Package Category Quad Flat Packages
  • Footprint Name Quad Flat Packages - LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
  • Released Date May 27, 2022
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

LPC2292FBD144,551 Details

  • Manufacturer Part Number:

    LPC2292FBD144,551

  • Brand Name:

    NXP Semiconductor

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-486-1, LQFP-144

  • Pin Count:

    144

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    ALSO REQUIRES 3.3V SUPPLY

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Number of I/O Lines:

    112

  • Number of Terminals:

    144

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Qualification Status:

    Not Qualified

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    60 MHz

  • Supply Voltage-Max:

    1.95 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC2292FBD144,551 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC2292FBD144,551 is -40°C to +85°C.
  • The clock settings for the LPC2292FBD144,551 can be configured using the PLL (Phase-Locked Loop) and the Clock Generation Unit (CGU). The PLL can be used to generate a clock frequency up to 60 MHz, and the CGU can be used to divide the clock frequency to generate the desired clock speed for the processor and peripherals.
  • The maximum current consumption of the LPC2292FBD144,551 depends on the operating frequency and the peripherals used. According to the datasheet, the maximum current consumption is around 450 mA at 60 MHz with all peripherals enabled.
  • A bootloader for the LPC2292FBD144,551 can be implemented using the In-System Programming (ISP) feature. The ISP feature allows the microcontroller to be programmed using a serial interface. The bootloader can be implemented using a combination of hardware and software, and it typically involves using a serial communication protocol such as UART or I2C to communicate with the host system.
  • The main difference between the LPC2292FBD144,551 and the LPC2294FBD144,551 is the amount of flash memory and SRAM. The LPC2292FBD144,551 has 256 KB of flash memory and 16 KB of SRAM, while the LPC2294FBD144,551 has 512 KB of flash memory and 32 KB of SRAM. Additionally, the LPC2294FBD144,551 has more peripherals and features, such as a USB interface and a CAN interface.

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LPC2292FBD144,551 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image LPC2292FBD144 NXP Semiconductors

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