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LPC3131FET180 - NXP

Description: ARM Microcontrollers - MCU LPC3131FET180/TFBGA180///STANDARD MARKING * TRAY D

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PCB Footprints
LPC3131FET180 - NXP PCB footprint - BGA - BGA - SOT570-3 (TFBGA180)
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3D Models
LPC3131FET180 - NXP  - 3D model - BGA - SOT570-3 (TFBGA180)
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LPC3131FET180 Details

  • Manufacturer Part Number:

    LPC3131FET180

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    12 X 12 MM, 0.80 MM PITCH, PLASTIC, SOT570-3, TFBGA-180

  • Pin Count:

    180

  • Manufacturer Package Code:

    SOT-570-3

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    ALSO REQUIRES 1.8V OR 3.3V SUPPLY

  • Bit Size:

    32

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PBGA-B180

  • JESD-609 Code:

    e1

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    180

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    180 MHz

  • Supply Voltage-Max:

    1.3 V

  • Supply Voltage-Min:

    1 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC3131FET180 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC3131FET180 is -40°C to +85°C, but it can be extended to -40°C to +105°C with some limitations on the clock frequency and voltage supply.
  • The boot mode of the LPC3131FET180 can be configured using the BOOTCFG pins (P2.10 and P2.11) and the ISP (In-System Programming) interface. The boot mode can be set to either ISP, UART, or SPI boot mode.
  • The maximum clock frequency that the LPC3131FET180 can operate at is 180 MHz, but it can be overclocked to 200 MHz with some limitations on the voltage supply and temperature range.
  • Secure boot on the LPC3131FET180 can be implemented using the on-chip ROM bootloader and the Secure Boot feature. This involves generating a secure boot key, creating a secure boot image, and configuring the boot mode to use the secure boot feature.
  • The LPC3131FET180 has 256 KB of on-chip flash memory and 32 KB of on-chip SRAM. It also has an external memory interface that can be used to connect external memory devices.

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LPC3131FET180 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image LPC3131FET180,551 NXP Semiconductors

RISC Microcontroller, 32-Bit, FLASH, ARM9 CPU, 180MHz, CMOS, PBGA180