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LPC4350FET180,551 - NXP

Description: ARM Microcontrollers - MCU Dual-core Cortex-M4/ M0, 264kB SRAM

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PCB Footprints
LPC4350FET180,551 - NXP PCB footprint - BGA - BGA - TFBGA180
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3D Models
LPC4350FET180,551 - NXP  - 3D model - BGA - TFBGA180
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LPC4350FET180,551 Details

  • Manufacturer Part Number:

    LPC4350FET180,551

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    SOT570-3, TFBGA-180

  • Pin Count:

    180

  • Manufacturer Package Code:

    SOT570-3

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PBGA-B180

  • JESD-609 Code:

    e1

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    118

  • Number of Terminals:

    180

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA180,14X14,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    270336

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    180 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.2 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC4350FET180,551 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC4350FET180 is -40°C to +105°C.
  • The pin multiplexing on the LPC4350FET180 can be configured using the PINMUX registers. Refer to the LPC4350 user manual for more information.
  • The maximum clock frequency for the LPC4350FET180 is 204 MHz.
  • The USB interface on the LPC4350FET180 can be used by configuring the USB registers and using the USB stack provided in the LPCOpen software development platform.
  • The LPC4350FET180 has 136 kB of SRAM, 264 kB of SRAM for Ethernet, and 1 MB of flash memory.

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LPC4350FET180,551 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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