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LPC54607J256BD208 - NXP

Description:  Up to 512 KB on-chip flash program memory with flash accelerator and 256 byte page erase and write.  Up to 200 KB total SRAM consisting of 160 KB contiguous main SRAM and an additional 32 KB SRAM on the I&D buses. 8 KB of SRAM bank intended for USB traffic.  16 KB of EEPROM.  ROM API support:  Flash In-Application Programming (IAP) and In-System Programming (ISP).  ROM-based USB drivers (HID, CDC, MSC, and DFU). Flash updates via USB.  Booting from valid user code in flash, USART, SPI, and

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Symbol
LPC54607J256BD208 - NXP - PCB symbol
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PCB Footprints
LPC54607J256BD208 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT459-1
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3D Models
LPC54607J256BD208 - NXP - 3D model - Quad Flat Packages - SOT459-1
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LPC54607J256BD208 Details

  • Manufacturer Part Number:

    LPC54607J256BD208

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-208

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • Has ADC:

    YES

  • Address Bus Width:

    26

  • Bit Size:

    32

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G208

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    171

  • Number of Terminals:

    208

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    180 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    28 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

LPC54607J256BD208 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the LPC54607J256BD208 is -40°C to 105°C.
  • The clock settings for the LPC54607J256BD208 can be configured using the Clock Control Unit (CCU) registers. The CCU provides a flexible clock generation and distribution system that allows the user to configure the clock sources, dividers, and multiplexers to meet the specific requirements of the application.
  • The maximum current consumption of the LPC54607J256BD208 depends on the operating frequency, voltage, and peripherals used. According to the datasheet, the typical current consumption is around 100 mA at 180 MHz, 3.3 V, and with all peripherals enabled.
  • The ADC on the LPC54607J256BD208 is a 12-bit successive approximation ADC with up to 8 channels. To use the ADC, the user needs to configure the ADC clock, select the ADC channel, set the ADC resolution, and start the ADC conversion. The ADC result can be read from the ADC result register.
  • Yes, the LPC54607J256BD208 can be used with an external crystal oscillator. The microcontroller has an on-chip oscillator circuit that can be connected to an external crystal oscillator to provide a stable clock source.

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LPC54607J256BD208 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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