LPC54628J512ET180 - NXP

LPC54628J512ET180 Details

• Manufacturer Part Number:

  LPC54628J512ET180

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  TFBGA-180

• Country Of Origin:

  Taiwan

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.25

• Date Of Intro:

  2017-06-14

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  8.08

• Has ADC:

  YES

• Address Bus Width:

  21

• Bit Size:

  32

• Clock Frequency-Max:

  25 MHz

• DAC Channels:

  NO

• DMA Channels:

  YES

• External Data Bus Width:

  16

• JESD-30 Code:

  S-PBGA-B180

• JESD-609 Code:

  e8

• Length:

  12 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  145

• Number of Terminals:

  180

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• ROM Programmability:

  FLASH

• Seated Height-Max:

  1.2 mm

• Speed:

  220 MHz

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  1.71 V

• Supply Voltage-Nom:

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  TIN SILVER COPPER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  12 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC